Glue for electronic industry

With the development and popularization of smart phones, smart wearable devices and other electronic products, the application requirements of hot melt adhesive in this field are becoming higher and higher. Smart phones are also developing towards integration, de screwing and frameless. Many hot melt adhesives have been unable to meet the development requirements of modern smart devices, and pur can just make up for the demand in the electronic field.

advantage

01-pur has high curing strength

It can meet the bonding requirements of most electronic products.

02-pur is easy to control the thickness of glue

03-pur is a moisture cured reactive polyurethane

The product bonded with pur hot melt adhesive can be disassembled and repaired.

In addition, the insulation performance, weather resistance, aging resistance and high and low temperature resistance of PUR are better than ordinary hot melt adhesive, and pur has a lower gluing temperature.

Application case

Wanli characteristic customization service

Product color can be customized - the color can be customized according to requirements.

Product model can be customized - Independent Model 88**。

Product technology can be customized - customized products for different materials to meet customers. User's test standards and process standards. 

Customizable - opening time, bonding, strength, initial strength, etc. 

The amount of glue can be customized - packaging method, weight, etc.